General-purpose Package - メーカー・企業と製品の一覧

Next-generation power module universal package [FLAP]

Next-generation power module universal package for high-performance devices such as SiC, GaN, and Ga2O3.

In conventional power module general-purpose packages, they were unsuitable for use with high-performance devices such as SiC, GaN, and Ga2O3. The next-generation power module general-purpose package FLAP developed by our company solves these issues and significantly improves indicators such as volume, thermal resistance, and package inductance compared to conventional products.

• 企業：大分デバイステクノロジー
• 価格：Other

• Other semiconductors
• EMS